Introduction to Co Packaging Socket Technology Designcon 2020
Exploring Co Packaging Socket Technology Designcon 2020 reveals several interesting facts. Chris Blackburn, Technologist at TE Connectivity, presents a new
Co Packaging Socket Technology Designcon 2020 Comprehensive Overview
Nathan Tracy, Technologist with TE Connectivity presents the XLA and dual compressive Integration of silicon photonics engines and ASICs will be leveraged to drive performance and cost efficiencies in data center ... Jake Joo of Dupont and Peter Johnson of SABIC discuss the future opportunities and challenges of
COBO/OIF Board Member Jeff Hutchins Discusses the Industry's
Summary & Highlights for Co Packaging Socket Technology Designcon 2020
- November 18,
- Bruce Champion, Signal Integrity Engineer with TE Connectivity, demonstrates 112 Gbps PAM4 electrical signal running over 2 ...
- This talk will cover high speed fiber optics for Data Centers and High Performance Computing with a focus on
- KT 250
- SABIC's Florian Jung on Thermoplastic Resins for Co-packaged Optics
Stay tuned for more updates related to Co Packaging Socket Technology Designcon 2020.